In electronics, an integrated circuit - Free Essay Example

Sample details Pages: 16 Words: 4687 Downloads: 3 Date added: 2017/09/20 Category Advertising Essay Type Argumentative essay Level High school Tags: Development Essay Did you like this example? In electronics, an integrated circuit (also known as IC, microcircuit, microchip, silicon chip, or chip) is a miniaturized electronic circuit (consisting mainly of semiconductor devices, as well as passive components) that has been manufactured in the surface of a thin substrate of semiconductor material. Integrated circuits are used in almost all electronic equipment in use today and have revolutionized the world of electronics. A hybrid integrated circuit is a miniaturized electronic circuit constructed of individual semiconductor devices, as well as passive components, bonded to a substrate or circuit board. Contents | |[hide] | |1 Introduction | |2 Invention | |3 Generations | |3. 1 SSI, MSI and LSI | |3. 2 VLSI | |3. ULSI, WSI, SOC and 3D-IC | |4 Advances in integrated circuits | |5 Popularity of ICs | |6 Classification | |7 Manufacturing | |7. 1 Fabrication | |7. 2 Packaging | |7. Chip labeling and manufacture date | |8 Legal protection of semiconductor chip layouts | | 9 Other developments | |10 Silicon labelling and graffiti | |11 Key industrial and academic data | |11. 1 Notable ICs | |11. 2 Manufacturers | |11. VLSI conferences | |11. 4 VLSI journals | |12 See also | |13 References | |14 Further reading | |15 External links | Introduction [pic] [pic] Synthetic detail of an integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish), and substrate (green). Integrated circuits were made possible by experimental discoveries which showed that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. The integrated circuits mass production capability, reliability, and building-block approach to circuit design ensured the rapid adopt ion of standardized ICs in place of designs using discrete transistors. There are two main advantages of ICs over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography and not constructed as one transistor at a time. Furthermore, much less material is used to construct a circuit as a packaged IC die than as a discrete circuit. Performance is high since the components switch quickly and consume little power (compared to their discrete counterparts) because the components are small and close together. As of 2006, chip areas range from a few square millimeters to around 350  mm2, with up to 1 million transistors per mm2. [edit] Invention [pic] [pic] Jack Kilbys original integrated circuit The idea of the integrated circuit was conceived by a radar scientist working for the Royal Radar Establishment of the British Ministry of Defence, Geoffrey W. A. Dummer (1909–2002), who published it at the Symposium on Progress in Quality Electronic Components in Washington, D. C. on May 7, 1952. [1] He gave many symposia publicly to propagate his ideas. Dummer unsuccessfully attempted to build such a circuit in 1956. Jack Kilby recorded his initial ideas concerning the integrated circuit in July 1958 and successfully demonstrated the first working integrated circuit on September 12, 1958. [2] In his patent application of February 6, 1959, Kilby described his new device as â€Å"a body of semiconductor material wherein all the components of the electronic circuit are completely integrated. † [3] Kilby won the 2000 Nobel Prize in Physics for his part of the invention of the integrated circuit. [4] Robert Noyce also came up with his own idea of an integrated circuit half a year later than Kilby. Noyces chip solved many practical problems that Kilbys had not. Noyces chip, made at Fairchild Semiconductor, was made of silicon, whereas Kilbys chip was made of germanium. Early developments of the integrated circuit go back to 1949, when the German engineer Werner Jacobi (Siemens AG) filed a patent for an integrated-circuit-like semiconductor amplifying device [5] showing five transistors on a common substrate arranged in a 2-stage amplifier arrangement. Jacobi discloses small and cheap hearing aids as typical industrial applications of his patent. A commercial use of his patent has not been reported. A precursor idea to the IC was to create small ceramic squares (wafers), each one containing a single miniaturized component. Components could then be integrated and wired into a bidimensional or tridimensional compact grid. This idea, which looked very promising in 1957, was proposed to the US Army by Jack Kilby, and led to the short-lived Micromodule Program (similar to 1951s Project Tinkertoy). [6] However, as the project was gaining momentum, Kilby came up with a new, revolutionary design: the IC. Robert Noyce credited Kurt Lehovec of Sprague Electric for the principle of p-n junction isolation caused by the action of a biased p-n junction (the diode) as a key concept behind the IC. [7] See: Other variations of vacuum tubes for precursor concepts such as the Loewe 3NF. enerations [edit] SSI, MSI and LSI The first integrated circuits contained only a few transistors. Called Small-Scale Integration (SSI), digital circuits containing transistors numbering in the tens provided a few logic gates for example, while early linear ICs such as the Plessey SL201 or the Philips TAA320 had as few as two transistors. The term Large Scale Integration was first used by IBM scientist Rolf Landauer when describing the theoretical concept, from there came the terms for SSI, MSI, VLSI, and ULSI. SSI circuits were crucial to early aerospace projects, and vice-versa. Both the Minuteman missile and Apollo program needed lightweight digital computers for their inertial guidance systems; the Apollo guidance computer led and motivated the int egrated-circuit technology[citation needed], while the Minuteman missile forced it into mass-production. These programs purchased almost all of the available integrated circuits from 1960 through 1963, and almost alone provided the demand that funded the production improvements to reduce production costs from $1000/circuit (in 1960 dollars) to merely $25/circuit (in 1963 dollars). [citation needed] They began to appear in consumer products at the turn of the decade, a typical application being FM inter-carrier sound processing in television receivers. The next step in the development of integrated circuits, taken in the late 1960s, introduced devices which contained hundreds of transistors on each chip, called Medium-Scale Integration (MSI). They were attractive economically because while they cost little more to produce than SSI devices, they allowed more complex systems to be produced using smaller circuit boards, less assembly work (because of fewer separate components), an d a number of other advantages. Further development, driven by the same economic factors, led to Large-Scale Integration (LSI) in the mid 1970s, with tens of thousands of transistors per chip. Integrated circuits such as 1K-bit RAMs, calculator chips, and the first microprocessors, that began to be manufactured in moderate quantities in the early 1970s, had under 4000 transistors. True LSI circuits, approaching 10000 transistors, began to be produced around 1974, for computer main memories and second-generation microprocessors. [edit] VLSI Main article: Very-large-scale integration [pic] [pic] Upper interconnect layers on an Intel 80486DX2 microprocessor die. The final step in the development process, starting in the 1980s and continuing through the present, was very large-scale integration (VLSI). The development started with hundreds of thousands of transistors in the early 1980s, and continues beyond several billion transistors as of 2009. There was no single breakthrough t hat allowed this increase in complexity, though many factors helped. Manufacturers moved to smaller rules and cleaner fabs, so that they could make chips with more transistors and maintain adequate yield. The path of process improvements was summarized by the International Technology Roadmap for Semiconductors (ITRS). Design tools improved enough to make it practical to finish these designs in a reasonable time. The more energy efficient CMOS replaced NMOS and PMOS, avoiding a prohibitive increase in power consumption. Better texts such as the landmark textbook by Mead and Conway helped schools educate more designers, among other factors. In 1986 the first one megabit RAM chips were introduced, which contained more than one million transistors. Microprocessor chips passed the million transistor mark in 1989 and the billion transistor mark in 2005[8]. The trend continues largely unabated, with chips introduced in 2007 containing tens of billions of memory transistors [9]. [edit] U LSI, WSI, SOC and 3D-IC ULSI, WSI, SOC and 3D-IC To reflect further growth of the complexity, the term ULSI that stands for ultra-large-scale integration was proposed for chips of complexity of more than 1 million transistors. Wafer-scale integration (WSI) is a system of building very-large integrated circuits that uses an entire silicon wafer to produce a single super-chip. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term Very-Large-Scale Integration, the current state of the art when WSI was being developed. A system-on-a-chip (SoC or SOC) is an integrated circuit in which all the components needed for a computer or other system are included on a single chip. The design of such a device can be complex and costly, and building disparate components on a single piece of silicon may compromise the efficiency of some elements. However , these drawbacks are offset by lower manufacturing and assembly costs and by a greatly reduced power budget: because signals among the components are kept on-die, much less power is required (see Packaging). A three-dimensional integrated circuit (3D-IC) has two or more layers of active electronic components that are integrated both vertically and horizontally into a single circuit. Communication between layers uses on-die signaling, so power consumption is much lower than in equivalent separate circuits. Judicious use of short vertical wires can substantially reduce overall wire length for faster operation Advances in integrated circuits [pic] [pic] The die from an Intel 8742, an 8-bit microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip. Among the most advanced integrated circuits are the microprocessors or cores, which control everything from computers to cellular phones to digital microwave ovens. Digital m emory chips and ASICs are examples of other families of integrated circuits that are important to the modern information society. While the cost of designing and developing a complex integrated circuit is quite high, when spread across typically millions of production units the individual IC cost is minimized. The performance of ICs is high because the small size allows short traces which in turn allows low power logic (such as CMOS) to be used at fast switching speeds. ICs have consistently migrated to smaller feature sizes over the years, allowing more circuitry to be packed on each chip. This increased capacity per unit area can be used to decrease cost and/or increase functionality—see Moores law which, in its modern interpretation, states that the number of transistors in an integrated circuit doubles every two years. In general, as the feature size shrinks, almost everything improves—the cost per unit and the switching power consumption go down, and the speed goes up. However, ICs with nanometer-scale devices are not without their problems, principal among which is leakage current (see subthreshold leakage for a discussion of this), although these problems are not insurmountable and will likely be solved or at least ameliorated by the introduction of high-k dielectrics. Since these speed and power consumption gains are apparent to the end user, there is fierce competition among the manufacturers to use finer geometries. This process, and the expected progress over the next few years, is well described by the International Technology Roadmap for Semiconductors (ITRS). edit] Popularity of ICs Only a half century after their development was initiated, integrated circuits have become ubiquitous. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies. That is, modern computing, communications, manufacturing and transport systems, including the Internet, all depend on the exi stence of integrated circuits. Classification [pic] [pic] A CMOS 4000 IC in a DIP Integrated circuits can be classified into analog, digital and mixed signal (both analog and digital on the same chip). Digital integrated circuits can contain anything from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, and micro controllers work using binary mathematics to process one and zero signals. Analog ICs, such as sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, mixing, etc. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult a nalog circuit from scratch. ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference. Manufacturing [edit] Fabrication Main article: Semiconductor fabrication [pic] [pic] Rendering of a small standard cell with three metal layers (dielectric has been removed). The sand-colored structures are metal interconnect, with the vertical pillars being contacts, typically plugs of tungsten. The reddish structures are polysilicon gates, and the solid at the bottom is the crystalline silicon bulk. [pic] [pic] Schematic structure of a CMOS chip, as built in the early 2000s. The graphic shows LDD-MISFETs on an SOI substrate with five metallization layers and solder bump for flip-chip bonding. It also shows the section for FEOL (front-end of line), BEOL (back-end of line) and first parts of back-end process. The semiconduc tors of the periodic table of the chemical elements were identified as the most likely materials for a solid state vacuum tube by researchers like William Shockley at Bell Laboratories starting in the 1930s. Starting with copper oxide, proceeding to germanium, then silicon, the materials were systematically studied in the 1940s and 1950s. Today, silicon monocrystals are the main substrate used for integrated circuits (ICs) although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs, lasers, solar cells and the highest-speed integrated circuits. It took decades to perfect methods of creating crystals without defects in the crystalline structure of the semiconducting material. Semiconductor ICs are fabricated in a layer process which includes these key process steps: †¢ Imaging †¢ Deposition †¢ Etching The main process steps are supplemented by doping and cleaning. Mono-crystal silicon wafers (or for sp ecial applications, silicon on sapphire or gallium arsenide wafers) are used as the substrate. Photolithography is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal (typically aluminium) tracks deposited on them. Integrated circuits are composed of many overlapping layers, each defined by photolithography, and normally shown in different colors. Some layers mark where various dopants are diffused into the substrate (called diffusion layers), some define where additional ions are implanted (implant layers), some define the conductors (polysilicon or metal layers), and some define the connections between the conducting layers (via or contact layers). All components are constructed from a specific combination of these layers. In a self-aligned CMOS process, a transistor is formed wherever the gate layer (polysilicon or metal) crosses a diffusion layer. †¢ Capacitive structures, in form very much like the parallel conducting plate s of a traditional electrical capacitor, are formed according to the area of the plates, with insulating material between the plates. Capacitors of a wide range of sizes are common on ICs. †¢ Meandering stripes of varying lengths are sometimes used to form on-chip resistors, though most logic circuits do not need any resistors. The ratio of the length of the resistive structure to its width, combined with its sheet resistivity, determines the resistance. †¢ More rarely, inductive structures can be built as tiny on-chip coils, or simulated by gyrators. Since a CMOS device only draws current on the transition between logic states, CMOS devices consume much less current than bipolar devices. A random access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even a microprocessor will have memory on the chip. (See the regular array structure at the bottom of the first image. Although the structures are intricate  œ with widths which have been shrinking for decades – the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to expose a layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process. Each device is tested before packaging using automated test equipment (ATE), in a process known as wafer testing, or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a die. Each good die (plural dice, dies, or die) is then connected into a package using aluminium (or gold) bond wires which are welded and/or Thermosonic Bonded to pads, usually found around the edge of the die. Aft er packaging, the devices go through final testing on the same or similar ATE used during wafer probing. Test cost can account for over 25% of the cost of fabrication on lower cost products, but can be negligible on low yielding, larger, and/or higher cost devices. As of 2005, a fabrication facility (commonly known as a semiconductor lab) costs over a billion US Dollars to construct[10], because much of the operation is automated. The most advanced processes employ the following techniques: †¢ The wafers are up to 300  mm in diameter (wider than a common dinner plate). †¢ Use of 65 nanometer or smaller chip manufacturing process. Intel, IBM, NEC, and AMD are using 45 nanometers for their CPU chips. IBM and AMD are in development of a 45  nm process using immersion lithography. †¢ Copper interconnects where copper wiring replaces aluminium for interconnects. †¢ Low-K dielectric insulators. †¢ Silicon on insulator (SOI) †¢ Strained silicon in a process used by IBM known as strained silicon directly on insulator (SSDOI) Packaging Main article: Integrated circuit packaging [pic] [pic] Early USSR made integrated circuit The earliest integrated circuits were packaged in ceramic flat packs, which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit a carrier which occupies an area about 30 – 50% less than an equivalent DIP, with a typical thickness that is 70% less. This package has gull wing l eads protruding from the two long sides and a lead spacing of 0. 050  inches. In the late 1990s, PQFP and TSOP packages became the most common for high pin count devices, though PGA packages are still often used for high-end microprocessors. Intel and AMD are currently transitioning from PGA packages on high-end microprocessors to land grid array (LGA) packages. Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow for much higher pin count than other package types, were developed in the 1990s. In an FCBGA package the die is mounted upside-down (flipped) and connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die periphery. Traces out of the die, through the package, and into the printed circuit board have very diffe rent electrical properties, compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. When multiple dies are put in one package, it is called SiP, for System In Package. When multiple dies are combined on a small substrate, often ceramic, its called an MCM, or Multi-Chip Module. The boundary between a big MCM and a small printed circuit board is sometimes fuzzy. [edit] Chip labeling and manufacture date Most integrated circuits large enough to include identifying information include four common sections: the manufacturers name or logo, the part number, a part production batch number and/or serial number, and a four-digit code that identifies when the chip was manufactured. Extremely small surface mount technology parts often bear only a number used in a manufacturers lookup table to find the chip characteristics. The manufacturing date is commonly represented as a two-digit year followed by a two-digit week code, such that a part bearing the code 8341 was manufactured in week 41 of 1983, or approximately in October 1983. Packaging Main article: Integrated circuit packaging [pic] [pic] Early USSR made integrated circuit The earliest integrated circuits were packaged in ceramic flat packs, which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit a carrier which occupies an area about 30 – 50% less than an equivalent DIP, with a typical thi ckness that is 70% less. This package has gull wing leads protruding from the two long sides and a lead spacing of 0. 050  inches. In the late 1990s, PQFP and TSOP packages became the most common for high pin count devices, though PGA packages are still often used for high-end microprocessors. Intel and AMD are currently transitioning from PGA packages on high-end microprocessors to land grid array (LGA) packages. Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow for much higher pin count than other package types, were developed in the 1990s. In an FCBGA package the die is mounted upside-down (flipped) and connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die periphery. Traces out of the die, through the pac kage, and into the printed circuit board have very different electrical properties, compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. When multiple dies are put in one package, it is called SiP, for System In Package. When multiple dies are combined on a small substrate, often ceramic, its called an MCM, or Multi-Chip Module. The boundary between a big MCM and a small printed circuit board is sometimes fuzzy. [edit] Chip labeling and manufacture date Most integrated circuits large enough to include identifying information include four common sections: the manufacturers name or logo, the part number, a part production batch number and/or serial number, and a four-digit code that identifies when the chip was manufactured. Extremely small surface mount technology parts often bear only a number used in a manufacturers lookup table to find the chip characteristics. The manufacturing date i s commonly represented as a two-digit year followed by a two-digit week code, such that a part bearing the code 8341 was manufactured in week 41 of 1983, or approximately in October 1983. Legal protection of semiconductor chip layouts Main article: Semiconductor Chip Protection Act of 1984 Prior to 1984, it was not necessarily illegal to produce a competing chip with an identical layout. As the legislative history for the Semiconductor Chip Protection Act of 1984, or SCPA, explained, patent and copyright protection for chip layouts, or topographies, were largely unavailable. This led to considerable complaint by U. S. chip manufacturers—notably, Intel, which took the lead in seeking legislation, along with the Semiconductor Industry Association (SIA)against what they termed chip piracy. A 1984 addition to US law, the SCPA, made all so-called mask works (i. e. , chip topographies) protectable if registered with the U. S. Copyright Office. Similar rules apply in most oth er countries that manufacture ICs. (This is a simplified explanation see SCPA for legal details. ) [edit] Other developments In the 1980s, programmable integrated circuits were developed. These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a single chip to be programmed to implement different LSI-type functions such as logic gates, adders and registers. Current devices named FPGAs (Field Programmable Gate Arrays) can now implement tens of thousands of LSI circuits in parallel and operate up to 550  MHz. The techniques perfected by the integrated circuits industry over the last three decades have been used to create microscopic machines, known as MEMS. These devices are used in a variety of commercial and military applications. Example commercial applications include DLP projectors, inkjet printers, and accelerometers used to deploy automobile airbags. In the past, radios could not be fabricated in the same low-cost processes as microprocessors. But since 1998, a large number of radio chips have been developed using CMOS processes. Examples include Intels DECT cordless phone, or Atheross 802. 11 card. Future developments seem to follow the multi-core multi-microprocessor paradigm, already used by the Intel and AMD dual-core processors. Intel recently unveiled a prototype, not for commercial sale chip that bears a staggering 80 microprocessors. Each core is capable of handling its own task independently of the others. This is in response to the heat-versus-speed limit that is about to be reached using existing transistor technology. This design provides a new challenge to chip programming. Parallel programming languages such as the open-source X10 programming language are designed to assist with this task. [11] Silicon labelling and graffiti To allow identification during production most silicon chips will have a serial number in one corner. It is also common to add the manufactuers logo. Ever since ICs were created, some chip designers have used the silicon surface area for surreptitious, non-functional images or words. These are sometimes referred to as Chip Art, Silicon Art, Silicon Graffiti or Silicon Doodling. [edit] Key industrial and academic data |[pic] |The lists in this article may contain items that are not notable, encyclopedic, or helpful. Please help out by removing| | |such elements and incorporating appropriate items into the main body of the article. (January 2008) | [edit] Notable ICs †¢ The 555 common multivibrator sub-circuit (common in electronic timing circuits) †¢ The 741 operational amplifier †¢ 7400 series TTL logic building blocks 4000 series, the CMOS counterpart to the 7400 series (see also: 74HC00 series) †¢ Intel 4004, the worlds first microprocessor, which led to the famous 8080 CPU and then the IBM PCs 8088, 80286, 486 etc. †¢ The MOS Technology 6502 and Zilog Z80 microprocessors, used in many home computers of the early 1980s †¢ The Motorola 6800 series of computer-related chips, leading to the 68000 and 88000 series (used in some Apple computers). [edit] Manufacturers For a list of microchip manufacturers, see List of integrated circuit manufacturers. VLSI conferences ICM – IEEE International Conference on Microelectronics †¢ ISSCC – IEEE International Solid-State Circuits Conference †¢ CICC – IEEE Custom Integrated Circuit Conference †¢ ISCAS – IEEE International Symposium on Circuits and Systems †¢ VLSI – IEEE International Conference on VLSI Design †¢ DAC – Design Automation Conference †¢ ICCAD – International Conference on Computer-Aided Design †¢ ESSCIRC – European Solid-State Circuits Conference †¢ ISLPED – International Symposium on Low Power Electronics and Design †¢ ISPD – International Symposi um on Physical Design ISQED – International Symposium on Quality Electronic Design †¢ DATE – Design Automation and Test in Europe †¢ ICCD – International Conference on Computer Design †¢ IEDM – IEEE International Electron Devices Meeting †¢ GLSVLSI – IEEE Great Lakes Symposium on VLSI †¢ ASP-DAC – Asia and South Pacific Design Automation Conference †¢ MWSCAS – IEEE Midwest Symposium on Circuits and Systems †¢ ICSVLSI – IEEE Computer Society Annual Symposium on VLSI †¢ IEEE Symposia on VLSI Circuits and Technology [edit] VLSI journals ED – IEEE Transactions on Electron Devices †¢ EDL – IEEE Electron Device Letters †¢ CAD – IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE web site for this journal †¢ JSSC – IEEE Journal of Solid-State Circuits †¢ VLSI – IEEE Transactions on Very Large Scale Integration (VLSI) Systems †¢ CAS II – IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing †¢ SM – IEEE Transactions on Semiconductor Manufacturing †¢ SSE – Solid-State Electronics Don’t waste time! Our writers will create an original "In electronics, an integrated circuit" essay for you Create order

The Scope Of Communication Essay - 1313 Words

Introduction The scope of communication has diversified in recent years - culturally, linguistically, and in delivery and form. According to some of the world’s leading researchers in English pedagogy, world societies have become â€Å"culturally and linguistically diverse and increasingly globalized.† (The New London Group, 4) As a result of these changes, as well as advances in technology, globalized communication resonates in nearly all areas of life in modern society. This ‘life writing’ as it is called takes place, often online, in social forums. With these diverse social forums come their own stigmas. For instance, Instagram - a photo sharing forum - contains its own lingo and modes of communication, it reaches particular groups within society and has a separate set of contributors than, say, reddit might. This leads to further sets of questions concerning social interaction. For the sake of this research, I have specifically analyzed a microcosm, or smaller digital community, within the context of the changing digital world. This community is includes a group of university students in Hawai’i who share a common interests in anime and the video games. The forum used by this community is called ‘Discord’, which is an application commonly used by online gamers to communicate with large groups from home. Within this research, I interviewed a close friend of mine who has been a part of this community for the past two years. While I came into the study with theShow MoreRelatedA Brief Note On Scope And Communication Management2218 Words   |  9 PagesScope and communication management are two of the major PM Knowledge Areas where poor practices contribute to project failure or success. Discuss why these two areas are so critical to project success and failure and give at least two examples of good practice in these areas (we want two e xamples overall, it could be one from each or two from one area) that help ensure success. Scope management Scope management is one of the major components of PM knowledge areas. This often refers to the processesRead MorePurpose And Scope Of Communications Management Plan Essay905 Words   |  4 Pages1 INTRODUCTION 1.1 PURPOSE AND SCOPE OF COMMUNICATIONS MANAGEMENT PLAN The purpose of this Communications Management Plan (CMP) is to define the processes required to ensure timely and efficient disposition of all project information. It also provides appropriate methods for information collection, screening, formatting and distribution of project information. Additionally, it provides an understanding among project teams regarding actions and processes necessary to facilitate the critical linksRead MoreDiscuss Whether the Postal Rule Should Continue to Be Applied, and the Scope of Communications Methods(If Any) That Should Be Covered by the Rule2489 Words   |  10 Pages|ASSESSMENT : RESEARCH ESSAY | | | |Discuss whether the postal rule should continue to be applied, and the | |scope of communications methods(if any) that should be covered by the rule | | | |Alfred | |22 May, 2012 Read MoreAdvise to a First Time Project Manager on a Software Application968 Words   |  4 Pagesproject scope statement Communicating effectively with team members The summary of my advice to Julianne will be that a successful project manager must at all times focus on successful execution of the project work scope and ensure that the project deliveries meet all the specified requirements. To achieve these objectives, the Project manager should pay close attention to three critical elements, name: †¢ Organizing people and resources †¢ Covering all aspects of the project scope statement Read MoreStakeholder Communication And The Development Of The Cgi Simulation Program901 Words   |  4 PagesStakeholder Communication â€Å"Stakeholders are as diverse as they are numerous. They can also exert various types of influence or power over the organization (Post 1999). Changes in a company s approach to communication and marketing must consider †¦ key stakeholders who are necessary for the survival of the corporation† (Clark, 1990, para. 2). Key internal stakeholder that will assist in the development of the CGI simulation program include: AGS management: environment artists, prop artist, characterRead MoreLesson Learned 3 : Inability1216 Words   |  5 Pagesinability to control scope change Scope management begins at the beginning of a project. In the planning process group, two types of â€Å"Scope† need to be carefully defined: product scope and project scope. The product scope here would be the features and functions requirements of the e-Borders system. The project scope here should be how the work would be done including the deadline for the project completion. A scope baseline need to be approved with the project scope statement plan andRead MoreConstruction Scope Of A Project Manager1644 Words   |  7 Pagesto define Project Scope no matter what methodology you choose to use. Defining what is needed is the first step towards establishing a project timeline, setting project goals and allocating project resources. These steps will help you define the work that needs to be done – or in other words, define the Scope of the project (CIO, 2011). Scope is the summation of all deliverables required as a part of the project. This includes all products, services and results (Kerzner). The Scope here, is to successfullyRead MoreThe Core Product We Are Developing Is 3d Imaging Software For Using Design For Creating A 3d Frontend Essay1319 Words   |  6 Pagesthis report are what our main deliverable is for this trimester, and our project management plans for communication, procurement, cost, scope, and the integration of them. At the end of this trimester, our main deliverable is a minimum viable product (MVP). This will be a very basic application with only the core functionality of a 3D front-end that the user can input data to, with communication to a database that will store the data. With a complete MVP we will be in a good position to review whatRead MoreHBP Simulation1056 Words   |  5 Pagesabsence of challenge. Here, an increase in SL up to 1.2 is often observed with higher TM, due to positive stress. However, from the SL 1.2, TM shrinks with further increases of SL due to negative stress. The target completion date and the project scope directly impact the SL and TM. They affect TM negatively if they are pessimistic or overly optimistic. Both are linked to the notion of challenge and benefit the project if they are slightly optimistic. Moreover, excessive and/or regular overtimeRead MoreThe Impact Of Communication On Project Performance1255 Words   |  6 Pages CHAPTER 1 INTRODUCTION 1.1 Background of study Communication is an essential key that will manipulate the organization operation by transfer of information. The research study about the impact of communication on project performance. This research will explore the communication method used and the effective communication method of construction industry in Kuantan. An introduction of what is the overall content of this research are shown in Chapter 1. This chapter will include background of

Canterbury Tales Essay Example For Students

Canterbury Tales Essay Throughout history all different parts of the world have been devastated bynatural disasters. Whenever something created by nature destroys a certain areaof the world, people tend to group together and overcome such a tragedy. Ourtale will begin in one of the busiest and diverse places in the world, New YorkCity. The month was September and the day started off a bit chilly for an earlyfall day and the wind was blowing hard. Warnings had been posted for possiblehurricane conditions, and the city had become a frenzy of activity. Some werebusy preparing for a possible devastating hurricane and gathering supplies whileothers were going about their daily routine unaffected by the chaos surroundingthem. As they day progressed the sky became darker and the wind picked upstrength. The possibility of a storm occurring increased by the minutes and soonbecame a citywide warning. By this time most people were able to understand thata violent and unpredictable storm was about to overtake the city , but there werestill some who didnt believe the reports from the weather channel. Soon therain started coming down in sheets and the wind increased to hurricane styleconditions topping over 100 mph. Power was lost quickly and buildings and homeswere being ripped apart from the wind and debris flying about. Parts of the citywere damaged severely from the beginning effects of the hurricane and there werepeople in need of help. The city officials prepared ahead of time and set upshelters for those who needed protection and assistance. I for one decided totake the opportunity and reside in a shelter for the vast majority of thepassing storm. As the storm progressed outside, the shelters quickly filled upwith terrified city-dwellers unable to predict what was occurring outside ofshelter walls. Natural disasters can bring about a caring and sensitive side inpeople, and those seeking comfort and relieve are able to turn to those aroundthem to receive this ease. The shelter I was residing in happened to gather aninteresting and diverse group of people. Myself and 24 others turned to reliedon each other and gathered together in a cluster and began to converse. Maybethey just wanted take their minds off of the hurricane outside, or maybe theywere just bored out of their minds, but whatever our reasons may have been doesnot matter. Because this gathering occurred allows me to tell you this tale Itwas hard to make small talk among such a large group so I came up with adifferent idea. I remember reading a book back when I was in high school where agroup of people told stories to pass their time on a long journey they were alltaking together. I figured that since none of us were going to be leavinganytime soon that we might give it a try. I suggested it to everyone andsurprisingly they all agreed. I explained to them the basic storyline of thebook that I was mimicking and they all felt that it would be interesting to seewho could come up with the most interesting and reali stic story that providedall the basics of humor and romance rolled into one. It was decided that aftereveryone completed his or her tale that we would take a vote to see which talethe majority enjoyed most. The winner would then receive a prize that would bedetermined later. Before I begin the stories, let me give you an introduction toeach one of the people that I was gathered with. I will present you with eachcharacter in the order that they introduced themselves. Ill begin with thelow-budget porn star. He is an out of work actor who had to turn to makingcheesy porn flicks so he could survive and pay his bills. He was just waitingfor his big break to come along so he could make it into real show business andbecome more well known outside of his typical porn circle. He was born andraised as a New Yorker and he has the New York accent to go with it. You cansense his intelligence from his choice of vocabulary and The Prostitute camenext. Now I dont mean to stereotype her at all, beca use she seems like a verynice girl. Her childhood was a rough one, starting from when she was just alittle girl. She grew up taking care of herself since her mother and fatherdecided that their social life came before her well being. Not only did herparents neglect her, her father also abused her. Unable to deal with livingthrough all the pain that was being inflicted on her, she decided to leave. Shewas a runaway at the age of 13 and escaped to the streets of New York City totry and make a living. Even though she had to learn to be an adult on her own atsuch a young age, she was still unable to make it successfully in the city. Herneed for money and lack of skills left very few options for her to pursue. Whiletrying to figure out what to do she met up with an older girl of 18 who had beenthrough the same ordeals and was willing to take her under her wing. This girlhappened to have succumbed to a life of prostitution, so this seemed to be thebest option she had that would provide he r with money. The Hillbilly was next tointroduce himself. He was raised on a small farm in Nebraska with his parents,six brothers, three sisters along with four grandparents, two aunts and twouncles and seven cousins. Being that he lived with such an extended family, hewas never able to receive much privacy and we will just say that his family wasvery close and tight-knit. When he reached the ripe old age of 15, he like manyof his friends turned to their cousins to marry and start a family. He wed hisneighborhood sweetheart, Betty-Sue and the two settled down into her familysattic. After failing at his life-long dream of being a NASCAR pit crew workerafter a freak accident involving a tractor trailer where he severely mangled hishand, he has succumb to a life of farming and raising 8 children. The hackercame next. By day he is a hard working bank teller, but by night he hacks intothe worlds most prestigious computer programs. Along with hacking he has a sidehobby of creating and des igning deadly computer viruses in hopes to one day ruinthe entire world computer system. He is a very secretive and anti-social type ofman. He has never had real friends, just random acquaintances from work orschool. His type of work requires total secrecy so he does not get caughttherefore he trusts no one. The Millionaire was a unique individual, and spokenext. He had the privilege of being born into money and he carried on thetradition and took over daddys corporate office and continued to make his ownmillions. At home in one of his several mansions he has a wife and two childrenwhom he hardly knows. Because of his lack of contribution towards his familylife his children dont know him and he and his wife have a non-existentmarriage. The Welfare Queen was next to speak. Her family consists of 6 children(all have different fathers) with one on the way. She was never taught how totake care of herself and is unable to understand the concept of hard work. Theonly way she knows how to survive is by constantly bearing children so she canreceive a larger welfare check each month. Currently she rents a 2-bedroom shackand shares it with her out-of-work boyfriend. She currently has 11 children andjust keeps popping them out in order to get her check every month. Next is theConceited Athletic Hero. Hes the type of guy who is too good to signautographs for small children who marvel at him and would rather pretend thatthey didnt exist. His father instilled in him that sports and winning wereeverything and that if you didnt bring him a trophy you would be ostracizedfrom the family. He doesnt love or even enjoy the sport he is playing; ratherhe just does it to get the paycheck each week. He has the garage full ofexpensive cars, the beautiful wife (whom he cheats on) and a plethora ofgorgeous houses. Since his life was empty and he had very little to life for, hechose to turn to drugs and alcohol to drain his sorrows. The Beauty Queen camenext. She was like many other self- centered beauty queens, whose life consistedof being obsessed with winning beauty contests. The first contest she enteredwhen she was two was the Beautiful Baby Contest, and she won. From then on herstage-mother continued training her since a baby. She instilled upon her thevalues and standards that winning is everything and that losing was just notacceptable. She has never been able to stand up to her mom and always dreamt ofthe day when she can escape from her grasps. Her dream was to run away toHollywood and become a famous actress and marry an actor. The day finally camebut instead of going out to Hollywood she came to New York City. She defiantlydid not give off the impression of being intelligent, more the dumb blonde type. The mind body distinction is a myth derived from philosophers such as Plato EssayDont worry. Im in the basement. They dont even know Im here.Joel was calm now and had time to think. OK, but keep it that way.The boss said reluctantly. We need the kid. No witness, no trial, you knowthe story. Look, Joel. Get some sleep and Ill come down tomorrow inperson. Sunlight shone through the vents along the east wall as Joel woketo answer the door. He was still dressed, but had been sleeping and was notfully alert. He opened the door and yawned. Before he had even closed his mouth,the assassin shot the silenced pistol, putting a large hole through Joels head. The assassin then stepped over the body and made his way to Adam, who wassleeping on the couch. He pulled a piece of nylon rope from his pocket andcompleted his mission. He then left the basement room as quietly as he hadarrived. No witness, no trial. Writing this paper allowed me to reach into mycreative side a produce a paper that I was to create a group of characters thatto me represented the American culture. Some of my characters I tended to baseon famous people, like the Barbara Walters news reporter. I felt that byincluding real people in my story I would be depicting a more realistic type ofcharacter that could be related to better because there would be something tocompare them to. Other characters were based on people that I have known, but Ichose not to tell their whole life story. Instead I chose a few differentmoments from throughout the years that I have had in contact with them, andcreated a character based on their life during a certain time period. Take forinstance t he Hard Working Mother, that character is based on my own mother, butfrom ten years ago. During that time she had to work two jobs in order tosupport my brother and myself while trying to keep up with payments on thehouse. The rest of my characters were based on just general characteristics ofpeople that I may have seen in a movie or on TV or from the news. Each characterthat I put into this tale was meant to represent an average group of people, andall 25 characters together were hopefully meant to symbolize all the Americanpeople in general. Everyone is not meant to be able to relate to the entirepersonality of a character or just one character, you should be able to sharethe same traits with bits and pieces of a few characters. Hopefully those whoread this will be able to associate with some of my characters and connectdifferent aspects of their life and views with the ones I have created. Thereason I chose to tell a story from the point of view of the Hacker is because Ifelt tha t his lack of trust in people would be the easiest for me to tell astory about. He was the perfect character to have the lack of confidence inother because of his lifestyle and chosen hobby. The story I told I hope gaveoff the impression that there is a good reason behind not trusting people andrelying on them to keep your best interest at heart. The Hacker being anintelligent man and his ability to hack into certain websites like the FBI andCIA may have come across this in the form of a case. Maybe he just conjured thestory out of his head so that he could show the entire group his reasons for nottrusting friends or family or colleagues. Wherever he got the idea for the storyfrom the reasoning behind it was still the same. Although I tried to parallel mytale and the Canterbury Tales closely, it was hard to follow exactly. It wasdifficult to try and give backgrounds for 25 completely various people,personality traits, views, and past experiences. It was also tricky to try anddecide which information you should provide the reader and how that particularcharacter would react to it. All in all I hope that my creations of 25characters did for the most part describe American life, as it is known today inthe Twenty First Century. In time these people will change and a new CanterburyTales will have to be written in order to conform to that particular generation. Canterbury Tales Essay Example For Students Canterbury Tales Essay Throughout literature, relationships can often be found between the author of astory and the story that he writes. In Geoffrey Chaucers frame story,Canterbury Tales, many of the characters make this idea evident with the talesthat they tell. A distinct relationship can be made between the character of thePardoner and the tale that he tells. Through the Prologue to the Pardonerstale, the character of the Pardoner is revealed. Although the Pardoner displaysmany important traits, the most prevalent is his greed. Throughout the prologue,the Pardoner displays his greed and even admits that the only thing he caresabout is money: I preach nothing except for gain (PardonersTale, Line 105). This avarice is seen strongly in the Pardoners tale aswell. In the Pardoners tale, three friends begin a journey in order to murderDeath. On their journey, though, an old man leads them to a great deal oftreasure. At this point, all three of the friends in the tale display a greedsimilar to the Pardoners. The three friends decide that someone should bringbread and wine for a celebration. As the youngest of the friends leaves to gobuy wine, the other two greedily plot to kill him so they can split the treasureonly two ways. Even the youngest decides to put it in his mind to buypoison / With which he might kill his two companions (383, 384). Thegreed, which is evident in the character of the Pardoner, is also clearly seenin the tale. Another trait that is displayed by the Pardoner and a character inhis tale is hypocrisy. Although the Pardoner is extremely greedy, he continuesto try and teach that Avarice is the root of all evil (6). Thecharacters in his tale display great hypocrisy as well. As the tale begins, thefriends all act very trustworthy and faithful towards all of their friends. Theynobly make a decision to risk their lives while trying to slay their friendsmurderer. As they talk about their challenge, they pledge to live and dieeach of them for the other, / As if he were his own blood brother(241-242). At the end of the tale, the brothers begin to revealtheir true nature. They all turn on each other in an attempt to steal thetreasure for themselves. All of the loyalty, which they had pledged, was simplya lie and no faithfulness remained. While the two older brotherplotted to kill the younger, the younger brother plotted tokill them both and never to repent (388). Thus, these so-called faithfulbrothers display their true ruthlessness and reveal their hypocrisyin relation to the Pardoners character. The characters in the PardonersTale match the unctuous nature of the Pardoner in a great deal of ways. All of these traits and ideas that are seen in both the Pardoner and the talethat he tells show a strong relationship in the two. Chaucer used this techniquein all of the tales that are recorded in Canterbury Tales. This technique givesa greater insight into the mind of the teller. By analyzing the tales, it ispossible to learn much about the teller of the tale. Using this method, Chaucerfocuses on the characteristics of each of the people involved in CanterburyTales, but also keeps the poem interesting. Book Reports

The Bebop Jazz Essay Sample free essay sample

Abstraction Bebop Jazz is considered a fad in 1945. Its tune attracted tonss of music lovers. It has fast beat and it is more complicated compared to a swing. Blue Monk and How High the Moon are one of its illustrations. The Bebop Jazz started in 1940 and evolved into a trend by 1945. It was the vanguard of wind. Unlike classical wind. little groups chiefly played it. Two horns. including cornet and saxophone. and rhythm instruments are Bebop’s important composing. Bebop progressed from Jam Sessions. an informal. insouciant and non-rehearsed group of instrumentalists. It was besides considered as an art signifier so Bebop instrumentalists called themselves creative persons. It was a nonstop development of blues patterned advance. Bebop music has fast beat ( although it can be played at any pacing ) but it needed a lighter attack. Its tunes are intricate and complex. Charlie Parker. Bud Powell. Lucky Thompson. Dizzy Gillespie. Kenny Dorham. We will write a custom essay sample on The Bebop Jazz Essay Sample or any similar topic specifically for you Do Not WasteYour Time HIRE WRITER Only 13.90 / page Ella Fitzgerald. and Thelonious Monk are among the celebrated creative persons of Bebop Jazz. Two of the Bebop wind that I’d heard are the Blue Monk of Thelonious Monk and the How High the Moon of Fitzgerald. The Blue Monk has chromatic. blues. pentatonic and melodious minor graduated tables. It employs two chief topics. one that advances and one that reiterate in a displaced manner. Fitzgerald’s How High the Moon is uses scats singing. and dramatic pacing alteration. The graduated tables used are major. blues. pentatonic. and melodious child. Both of the composings have fast beat. Mention Manners of Jazz Music. ( 2008 ) . A Passion for Jazz. Retrieved 07 May. 2008 from hypertext transfer protocol: //www. apassion4jazz. net/jazz_styles. hypertext markup language.